COB LCD
COB LCD
“Chip on board” means the chip is bound to the PCB, this can greatly reduce the module volume, but also reduce the cost.
The COB process adopts small bare chip with high equipment precision, which is used to process PCB boards with more lines, thinner clearance and smaller area requirements. After the chip is welded and pressed, it is sealed with black glue to protect the solder joints and welding lines from external damage, with high reliability. However, it cannot be repaired after the damage and can only be scrapped.
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